A huge problem for electronics manufacturers cutting expensive materials like silicon wafers on a microscopic scale creates a ton of sawdust. But now, the researchers over at the Fraunhofer Institute have found a way to make precise ultra-thin saws from carbon nanotubes covered with an outer layer of lab grown diamonds.

The new saw coats carbon nanotube based wires in diamonds resulting in a strong but incredibly thin cutting to minimize the amount of material lost.

[Fraunhofer Institute]